E by Dek


Description

E by DEK – Aligned to your application needs by
Flexible, Modular and Scalable Platform

E-by-DEK – the new standard for mid-speed SMT printing. The E-by-SIPLACE has already set new standards in quality, performance and ease of use in the mid-speed placement segment. Now it is being joined by the ideal printer solution: E-by-DEK. High-quality components, sophisticated construction, modular design: The E-by-DEK is the result of over 40 years of experience in machine design and printing technology. Your benefit: Stable and reliable printing processes – also for fine-pitch applications. The E by DEK becomes even better when it interacts with the E by SIPLACE: The shared E-line monitor provides your operators with a central overview of the entire E-line.

With its modular design, the latest generation of our powerful screen printers is customizable for any customer-specific or application-specific requirements. Clamping systems, conveyors, tooling, paste management, verification – the E by Dek can be equipped and/or retrofitted with many powerful and precision-enhancing options. All this flexibility can be controlled easily and comfortably with the leading printer software: DEK Instinctiv™ V9.

The E by Dek with the DEK HawkEye 750 camera system, semi-automatic stencil load and the IUSC understencil cleaning system features a core cycle time of 11.0 seconds and a machine accuracy of ±25 µm @ 2 Cmk for use in high-mix environments.

The innovative design of the new printer and its especially robust cover make it possible to perform all control and maintenance operations from the front of the machine.

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Technical data

Technical data for the E by DEK Printer

BROCHURE

 

Machine Alignment Capability 2 Cpk @ +/- 12.5um, 6 Sigma
Process Alignment Capability 2 Cpk @ +/- 25um, 6 Sigma
Cycle Core Time 8 seconds
Max. Board Size (Print Area) 510mm (X) x 508.5mm (Y)
Screen/Stencil Frame Size (maximum) 736mm x 736mm (29” x 29”) x 25mm to 38mm (1” to 1.5”) height. Other frame sizes
can be loaded with adjustable stencil mount AWSM (optional) or adaptor frame
Temperature & Humidity Sensor Feeback and monitoring of internal print area environment.
Tooling Deviation Monitoring Verification of optimum set-up of substrate support.
Pressure Feedback Squeegee head with pressure feedback.
Under Stencil Cleaning Interchangeable Under stencil (IUSC) cleaner, fully programmable with wet/dry/vacuum wipe
Vacuum Assist for Under Stencil Cleaning On board vacuum unit 20 litre/sec airflow