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Description

TRANSPORT SYSTEM

Reliable transport through the oven: flexible conveyor system

Your PCB passes through various system segments during the soldering process: from the preheating zone to the peak zone, and finally to the cooling tract. The most important factor for continuous processing is reliable conveyance. Our systems provide users with a customized conveyor.

Whether large or small, thick or thin, long or short – our conveyor systems can be ideally adapted to your PCB. Conveyor lanes and transport speeds are flexibly adjustable. In this way, the VisionXS makes lead-free or lead-containing soldering processes possible in a single reflow system..

Getting safely from A to B: flexible conveyor systems

Your PCB passes through various system segments during the soldering process: from the preheating zone to the peak zone, and finally to the cooling tract. The most important factor for continuous processing is reliable conveyance. Our systems provide users with a flexible conveyor.

Whether large or small, thick or thin, long or short – our conveyor systems can be ideally adapted to your PCB. Conveyor lanes and transport speed are flexibly adjustable. In this way, the VisionXP+ makes lead-free or lead-containing soldering processes possible in a single reflow system.

 

 

 

Various conveyor options

Various conveyor options are available depending on system configuration:

 

 

 

 

 

With or without center support – the choice is yours!

In the case of large PCBs or flexible substrates, the center support prevents sagging during the reflow process, thus assuring high levels of process stability. The temperature profile is not influenced by the center support – a further factor which contributes to a stable process.If the center support is not required, it can be lowered to a parking position in close proximity to the first conveyor rail.

 

 

 

RESIDUE MANAGEMENT

Reliable and clean – effective Residue Management

Substances are released from the PCBs, the solder paste and the components during production with modern SMT manufacturing lines, and these can lead to contamination of the soldering system and must therefore be filtered out of the process gas. Modern ovens with nitrogen atmosphere are equipped with so-called residue management systems which recirculate process gas within the system and purify it.

Residues which accumulate during soldering are separated by the VisionXC with the help of an efficient filter unit. The 1 to 3-stage residue management system is integrated at the front of the system. Each stage consists of a cooler and a filter. Liquid and crystalline residues are reliably removed by means of this combination. This results in minimal maintenance costs and more efficient production.

Filter/cooler units VXC

The advantages at a glance:

  • Thorough purification and a clean process chamber
  • Solution integrated into the system
  • Reliable process
  • Easily accessible
  • Minimal maintenance costs

 

 

                                      Pyrolysis Schematic

The residue management function included in the VisionXS and  VisionXP+ combines two different modes of action: pyrolysis in the heat zone and cold condensation in the cooling tract’s filter units. Liquid and crystalline residues are effectively removed by means of this combination. Residues are separated with the help of a special granulate during pyrolysis.

Before Cracking | After Cracking

 

 

Long molecular chains are broken down (cracked) into smaller elements by means of thermal fission. Temperatures ranging from 500 to 900 °C are required to this end. Afterwards, the molecular chains are small enough to be taken up by the granulate and removed from the production process. The granulate only needs to be changed once a year, making the pyrolysis unit easy to maintain – and you profit from minimal downtime. Your manufacturing processes continue to run smoothly.

Liquid residues condense above all on the cooling tract’s filter units, by which they are then removed. The system is easy to clean. The filters are exchanged in sets at the back of the system. The process chamber doesn’t even have to be opened.

In order to make your manufacturing system even more efficient, the VisionXP+ is optionally available with double pyrolysis. Your system’s cleaning efficiency is significantly increased. The first pyrolysis unit is located underneath the inlet area. It purifies the nitrogen from the preheating zones. The second pyrolysis unit is installed beneath the outlet area and filters the process gas from the peak zones. Cleaning efficiency is significantly increased for the process gas and the soldering system’s chambers are kept clean and dry with very little maintenance and minimal downtime.

 

Advantages of VisionXP+ Residue Management

Filter/cooler units VXP+

  • The system is kept clean and dry in the inlet area, as well as in the preheating and peak zones
  • Double pyrolysis for increased cleaning effectiveness (optional)
  • Minimal maintenance: the pyrolysis unit is entirely maintenance-free for a full year
  • Long granulate service life (roughly one year)

 

 

VACUUM

Multiple applications of vacuum

Without vacuum

Void-free, with vacuum

Vacuum technologies are important in the manufacturing process of electronic assemblies. In the different processing steps for improving the quality, the vacuum is in use today. Rehm provides solutions within the convection or condensation soldering to improve solder joint quality by removing voids. The new VisionXP + can be equipped for example with a vacuum module and makes void-free convection possible. In addition, any system of CondensoX seiesare equipped with an optional vacuum process. Furthermore vacuum technology are focussed in the process of drying coated electronics. Energy-efficient, low maintenance and void-free – we offer innovative solutions for reflow soldering based on diverse options for the VisionXP+ system. A new vacuum model now permits convection soldering processes with partial vacuum – within a single process.

 

The VisionXP+ with vacuum option reliably removes pores, gas occlusions and voids immediately after the soldering process – while the solder is in an ideally molten state. Void rates of less than 2 % are made possible by vacuum of down to 2 mbar. Pressure and speed can be individually adjusted. This integrated solution results in a more time-efficient and stable production sequence. Time-consuming processing of the PCB in an external vacuum system is no longer necessary – the workpieces are transferred from the peak zones directly to the vacuum process.

Vacuum after the soldering process for fewer voids

  • Vacuum down to 2 mbar for reducing the number of voids in the solder joints

  • Three-part conveyor: preheating and peak zone, vacuum module, cooling tract
  • Infinitely adjustable, automatic advancing of the process chamber to the processing or the maintenance position
  • Clean vacuum chamber thanks to two pyrolysis units and separate filtering of the depressurized atmosphere in the vacuum chamber
  • Minimal downtime thanks to low maintenance
  • Outstanding cooling performance, cooling time can be extended by means of synchronization
 

 

 

COOLING TRACT

 

Effective cooling of the PCBs

Efficient Cooling Tract for Low Outlet Temperatures. VXS and VXP+

Efficient Cooling Tract for Low Outlet Temperatures. VXC

Depending on system length, the VisionX is equipped with a 2, 3 or 4-stage cooling tract. The fans in the individual zones, which can be controlled separately as an option, allow for accurate control and cooling gradients can be correspondingly influenced. This assure stress-free cooling for your PCBs to below 50 °C, for lead-free soldering as well.

 

ENERGY EFFICIENCY

 

Energy-efficient system ensures reduced operating costs

The VisionXP+ is our best-in-class convection reflow soldering system which is clearly in line with the trend towards dealing with natural resources in an environmentally sound fashion. The industry sector will have to do some rethinking – and machinery manufacturing won’t be able to ignore this development.

Rehm’s energy concept combines a top quality, sustainable production system with the requirements of modern manufacturing companies. Special emphasis was placed on energy-efficiency, reduced emissions and low operating costs during development of the VisionXP+.

With the help of the VisionXP+, our customers are verifiably able to reduce energy consumption by up to 20 % and produce 10 tons less CO2 per year on the average. A true energy wizard with outstanding performance.

 

Unique technological advantages:

  • Process stability
  • Environmentally aware management of resources
  • Greatly reduced consumption of energy, nitrogen and coolant water in the standby mode
  • Outside panel temperature of max. 15° C above room temperature
  • Noise level reduction to less than 70 dB
  • Full control thanks to monitoring of current, nitrogen and energy consumption for cooling
  • Durable insulation for greatly reduced transfer of heat to the environment
  • Minimal maintenance costs
  • Efficient residue management
  • Outstanding traceability through the use of numerous software tools

 

OTHERS

 

Electric Energy Saving

Whenever no boards are inside the oven the fan speed is automatically reduced to 25Hz
* only in combination with option nitrogen control
 

 

 

 

 

Technical data

System configuration Convection soldering

BROCHURE
VXP+ VAC VXP+ VXS VXC
TRANSPORT SYSTEM
Mesh belt no no option option
Single lane standard standard standard standard
Dual lane option option option no
Multi track no option option no
Quad lane no option no no
RESIDUE MANAGEMENT
Cold condensation with cooler/filter units only nitro systems standard standard standard standard
Pyrolysis standard standard option no
2nd Pyrolysis no option no no
VACUUM
Vacuum module standard no no no
COOLING TRACT
Bottom cooling no option no no
PCU Power Cooling Unit option option option no
integr. cooling circuit and heat exchanger for connection to ext. facility water supplies standard standard standard no
ENERGY EFFICIENCY
Internal cooling / elimination of heat emission option option option option
Measurement power consumption option option option option
Measurement nitrogen consumption option option option option
Supervision of volume flow with active readjustment option option no no
SOFTWARE
Product management option option option option
Traceability packages option option option option
Process interlock option option option option
ProCap option option option option
Profile Creator no option option option
KIC implementation option option option option
RPI option option option no
MES-Option ROI option option option option
OTHERS
Stand-By-Mode standard standard option no
SSP no no option no
SSP+ option option no no
Quick Exhaust option option option no
Transmission zone standard standard option option
Software control for fan speed regulation standard standard option option
Pin in Paste option option option option