VisionXS The flexible Reflow Soldering System with futures
As a co-founder of modern ReflowConvection-Soldering Systems the company Rehm has been established successfully since 1990 in the national market as well as worldwide. The know-how and experience in reflow technology of many years is now integrated in the VisionXS-series. Optimized for customer requirements the VisionXS stands for productivity and flexibility.
The Transport System
Maintenance and downtime are reduced by means of a continuous process based on an absolutely reliable conveyor, as well as an ingenious mechanical system.
The conveyor system has been laid out in accordance with requirements specified for future placement machines, and optional for a maximum width of 508 mm.
The optionally available center support makes it possible to process large panel formats – an additional advantage for flexible manufacturing!
Ideal Heat Transfer
Heat transfer has been significantly optimized for the VisionXS through the use of two, three or four peak zones.
Minimal distance between the nozzle sheets and the conveyor, as well as separately adjustable flow rates for the upper and lower heat zones, assure that the PCBs are heated up in an extremely uniform fashion. Stressing within the PCBs is thus minimized, and related soldering defects are reduced.
Stress-free below 50°
Depending upon the length of the system, the cooling tract in the VisionXS nitro is laid out in 2-, 3 or 4 stages. The fans in the individual
zones, which can be controlled separately as an option, allow for accurate control, and cooling gradients can be correspondingly influenced. This assures stress-free cooling for your PCBs to below 50° C, for lead-free soldering as well.
The Residue Management System
Residues which accumulate during soldering are separated by a new residue management system included in VisionXS systems. The 3-stage Residue-Management System is integrated in the oven. Each stage consists of a cooling and a filter unit. For processes with an extremely high amount of residues the extended Modular Residue-ManagementSystem (MRS) can be attached. This guarantees an absolute stable process and reduces down-time. Both systems are exchangable for the existing machine.
With the nitrogen control the desired ppm level is held constant by continuously measuring the residual oxygen value. This is accomplished by injecting nitrogen into the process chamber in a variable fashion depending upon the measured residual oxygen
value. This results in varying nitrogen consumption levels depending upon the extent to which the reflow system is loaded with PCBs and the selected conveyor width, allowing for reduced nitrogen consumption.
Nitrogen control is advisable for flexible SMD production lines with variable loading circumstances and conveyor widths.
In the case of air doping, the process chamber is contaminated with atmospheric oxygen. A defined leak is created in the process chamber by means of a servo-valve to this end, which is opened just far enough to generate the desired residual oxygen value. The reflow system’s nitrogen consumption is not influenced by this procedure, and always remains constant. Air doping is advisable for SMD production lines for which loading circumstances and conveyor widths vary only minimally in the reflow oven.