Depaneling

Regardless of material, size or contour – our DIVISIO depaneling systems depanels your printed circuit board from the panel with a precision of 10┬Ám. Whether as an stand alone solution, inline or offline system – we supply a machine that is perfectly oriented to your requirements and your production. In doing so, we rely on proven separation processes: sawing, routing or laser cutting. The 1000th system sold speaks for the success and experience in 20 years of DIVISIO depaneling systems.