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DIVISIO 4000 Series

Regardless of material, size or contour - our DIVISIO depaneling systems depanels your printed circuit board from the panel with a precision of 10µm. Whether as an stand alone solution, inline or offline system - we supply a machine that is perfectly oriented to your requirements and your production. In doing so, we rely on proven separation processes: sawing, routing or laser cutting. The 1000th system sold speaks for the success and experience in 20 years of DIVISIO depaneling systems.

Our Highlights:

  • Depaneling process for every application
  • Individual degree of automation
  • Scalable functions
  • Parallelization of processes in one system

The DIVISIO 4000 is a unit for high volumes and a small product mix. Arriving panels are transferred to a conveyor where they are lifted up and then picked up by the gripper adapter. The cutting tool (spindle or saw) is mounted in a fixed position into the unit and the panel then travels over it. A double spindle can also be installed to increase productivity.
The unloading conveyor can either be a flat belt conveyor, a double belt conveyor, product carrier, shuttle or a combination of them.


  • Linear motors for highest dynamics and accuracy
  • Tool coding
  • Automatic router-bit exchange
  • Quick change adapter system
  • Spring loaded hold down clamp assembly
  • SIMPLEX HMI offers comfortable operation
  • Ionization unit
  • ESD spindle
Transport height
Max. transport width
Transfer direction
Operating side
Fixed rail
Panel Dimensions
Panel length
Panel width
Panel thickness
Panel weight max.
PCB weight max.
Component height, spindle-side
Component height, gripper-side
Machine Description
Length x Width x Height
Noise Level
Machine networking via IC Net
850mm ±50mm
Siemens, SMEMA
From left to right
Front of the machine
Front of the machine
Panel Dimensions
up to 360mm
up to 320mm
0.8 to 4.5mm
8mm; partial 18mm (other height on request)
Machine Description
1448 x 2229 x 2008mm
1250kg (standard equipped)
±0.015mm (20°C ±1°C)
±0.005mm (20°C ±1°C)
Less than 75dB(A) (possible deviations due to material mix of the panel)

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