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AOI – Nordson

Nordson TEST & INSPECTION is a leading global provider of automated optical inspection systems, called AOI. Founded and managed by a team of industry experts with a history of success, Nordson TEST & INSPECTION brings powerful, cost-effective yield enhancement solutions to the market. Our state-of-the-art automated optical, microelectronics and solder paste inspection systems provide our customers with fast, accurate inspection they can count on. Our ongoing mission is to offer the most advanced AOI solutions in the industry, while providing excellence in customer service and support. Our award winning AOI solutions are ideally suited to meet our clients' unique demands. We are committed to the advancement of quality AOI solutions, and ever striving for customer service excellence.

Ultra-High Resolution, 5 Micron – Multi-Reflection Suppression (MRS) Technology

The SQ3000+ is powered by CyberOptics’ proprietary 3D sensing technology with sophisticated fusing algorithms that enables metrology grade accuracy at production speed. The result is ultra-high quality 3D images, high-speed inspection and metrology, and improved yields and processes.


SQ3000+ offers unmatched accuracy with the advanced MRS sensor technology by meticulously identifying and rejecting reflection-based distortions caused by shiny components and surfaces. Effective suppression of multiple reflections is critical for accurate measurements. The new, ultra-high resolution 5 micron MRS sensor incorporated into the SQ3000+ is specifically designed for advanced applications with the most demanding requirements.

Inspection and Metrology Solution for Assembly and Process Improvement for Advanced Applications

The SQ3000+ with MRS technology is ideal for high-end applications including advanced packaging, mini/micro LED, advanced SMT applications for automotive, medical, military, aerospace and advanced electronics, 008004/0201 solder paste inspection (SPI), socket metrology and other high-end coordinate measurement (CMM) applications where quality and reliability are critical.

Intuitive, Easy-to-Use Software – Enable Smarter, Faster Inspection

The multi-award winning SQ3000 AOI software is a more powerful yet extremely simple software suite designed with an intuitive interface and multi-touch control with 3D image visualization tools. Ultra-fast programming capabilities bring the ease-of-use to a completely new level and significantly speeds setup, simplifies the process, reduces training efforts and minimizes operator interaction – all saving time and cost.

Speed programming and tuning with new capabilities including AutoTeach, AutoTune and AutoDefine for faster set-up and a simplified process. AI² (Autonomous Image Interpretation) technology is all about keeping it simple – no parameters to adjust or algorithms to tune. And, you don’t need to anticipate defects or pre-define variance either. AI² does it all for you, powered by a data-rich, pre-loaded library and automated scripts that collect and update models all on their own. With AI², you have the power to inspect the most comprehensive list of features and identify the widest variety of defects. AI² offers precise discrimination with just one panel inspection making it a perfect solution for high-mix and high-volume applications.

Faster, Highly Accurate Coordinate Measurement (CMM) Suite

CyberCMM™, a comprehensive software suite of coordinate measurement tools, provides highly accurate, 100% metrology-grade measurement on all critical points much faster than a traditional CMM, including coplanarity, distance, height and datum X, Y to name a few. A fast and easy set-up can be performed with the world’s first in-line CMM system for programming complex applications as compared to slow, engineering resource-intensive set-up that typically requires multiple adjustments with traditional coordinate measurement machines (CMMs).

Inspection Speed

16 cm²/sec (2D+3D)

PCB Size

Minimum: 50 x 50 mm (2 x 2 in.);
Maximum: 420 x 320 mm (16.5 x 12.5 in.)

Resolution XY / Z

5 µm / 0.1 µm

Maximum Weight (PCB or Sample)

10 kg

Component Types Inspected

Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and more

Solder Joint and Other Defects

Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins

Minimum Component Size

0201 mm (008004 in.)

Component Height Clearance

Top: 20 mm ; Bottom: 50 mm

Field of View (FOV)

25 x 25 mm

Min./ Max. Feature Height

Min. 10 µm ; Max. 400 µm at spec, 2.4 mm capability

Component Defects

Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more

Coordinate Measurement Capability

Line / Distance / X,Y / Mid Line, Inter Point / Regression Shifted, Datum X,Y / LSF X,Y Offset, X,Y Offset / Value / Location / List of X,Y Values, Height / Local Height / Regression / Radius, Coplanarity/ Distance to plane / 2nd Order fitting, Difference / Absolute / 2sqrt / VC, Max / Min / Ave / Sigma / Plus / Minus / Multiple

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