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DEK APC (All Purpose Clamping)

Printing close to the edge.

DEK APC (All Purpose Clamping) is DEK’s new universal clamping system. The board can be clamped top-down and/or laterally (snugging). Additionally, the over-top clamps can be retracted if required.

DEK APC delivers many benefits

Retracting of the over-top clamps allows for high-quality printing close to the edge.

The flexible clamps secure the clamping of warped boards from the top DEK APC automatically adjusts to the board’s thickness
The clamping pressure is controlled and can be stored in the product file. The settings will be applied automatically for subsequent production runs.

You save time and improve printing quality.

Technical specifications

  • Rail Type: Modular Rails with Dual Speed Motors is standard 
  • Minimum Substrate Size: Host capability not affected by option
  • Maximum Substrate Size: Host capability not affected by option
  • Minimum Substrate Thickness: 0.5mm*
  • Maximum Substrate Thickness: 6.0mm
  • Maximum Substrate Warpage: Board Thickness + Warpage = < 6mm 
  • Maximum Substrate Weight: Host capability not affected by option
  • Minimum AWSM Width: 562mm minimum stencil frame size required 
  • Clamp Length: 380mm
  • Clamp Modes: Clamp Snug ; Snug and Clamp
  • Clamp Force Setting: 1.5 to 5 bar
  • Snugger Length: 356mm
  • Snug Force Setting: 20 to 60 Newtons
  • Clamp Overhang on Substrate: 1.5mm (Maximum per clamped edge)
  • Transport Direction Host capability: not affected by option
  • Underside Edge Support Thickness: 3.5mm (Maximum per clamped edge)
  • Underside Edge Support Length: Standard 500mm
  • Component Under Clearance Host capability: not affected by option
  • ESD Compatibility: Yes
  • Substrate Edge Straightness: +/- 0.05mm
  • Substrate Edge Parallelism: +/- 0.5mm
  • Board Aspect Ratio: Host capability not affected by option
  • Transport Height: Host capability not affected by option
  • Core Cycle Time: 8 seconds when using Over the Top Clamping Mode (standard foils)

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