Cyber Optics SE3000-D


Description

SE3000-D™
True Measurement, Supreme Quality
Performance at its Best (Accuracy and GR&R)

The new SE3000-D™ SPI system incorporates the industry leading MRS sensor technology with a finer resolution for the best accuracy, repeatability and reproducibility – even on the smallest paste deposits. Combined with the award winning, easy-to-use SPI software, solder paste inspection has a new level of precision for the
most stringent requirements. Standard SE3000, Dual Lane – Dual Sensor with SE3000-DD and Single Lane Large Board Capability with SE3000-X are also available.The SE3000-D™ is powered by CyberOptics’ breakthrough 3D sensing technology comprising of two MRS Sensors delivering metrology grade accuracy at production speed. CyberOptics’ unique sensor architecture simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together. The result is ultra-high quality 3D images and high-speed inspection.

 

Intuitive, Easy-to-Use Software

The SE3000-D™ software is a powerful yet extremely simple design with an intuitive interface that reduces training efforts and minimizes operator interaction  saving time and cost. The software includes multi-touch controls and 3D image visualization tools, taking ease-of-use to a whole new level.

AI2 – Faster, Smarter Programming

AI2 (Autonomous Image Interpretation) technology is all about keeping it simple – no parameters to adjust or algorithms to tune. And, you don’t need to anticipate defects or pre-define variance either – AI2 does it all for you. With AI2, you have the power to inspect the most comprehensive list of features and identify the widest variety of defects. AI2 offers precise discrimination with just one panel inspection making it a perfect solution for high-mix and high-volume applications

Alternative High Speed, Serial Configuration 2x Single Lane

  • New system hardware.
  • Dual track, One sensor, Dual Gantry, one PC
  • Any combination of product for Lane 1, Lane 2.
  • Different sensor combinations may be mounted.

 

CyberOptics’ unique sensor architecture with multi-view 3D sensors and a parallel projector, simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing
algorithms merge the images together, delviers metrology grade accuracy at production speed.
The dual lane system maximizes flexibility catering to varying PCB widths. This unique design provides the ability to inspect high volume assemblies, the convenience of inspecting different assemblies and board sizes on different lanes, or even switching
from dual lane to single lane mode to inspect very large boards.

Flexibility At Its Best

The SE3000-D™ 3D SPI system is an extension of the award-winning SQ3000™ 3D AOI platform. The dual lane, dual sensor system maximizes flexibility catering to varying PCB widths. This unique design provides the ability to inspect high volume assemblies, the convenience of inspecting different assemblies and board sizes simultaneously on different lanes, or even switching from dual lane to single lane mode to inspect very large boards.
Not only does the SE3000-D™ provide PCB flexibility, it also provides the flexibility to choose two of the same or two different proprietary MRS sensors

 

MRS Sensor Technology

  • Industry-leading sensor technology now integrated into SPI

Phase Shift Profilometry

  • Sensor – Structured White Light
  • Measurement – Advanced Optical Triangulation

High Speed On-the-Fly Inspection

Single Illumination Sensor Dual Illumination Sensor

Speed, Performance Accuracy, Shadow Free

Continuous image acquisition delivering high accuracy and consistent repeatability

Intuitive, Easy-to-Use Software

The SE3000 software is a powerful yet extremely simple
design with an intuitive interface that reduces training efforts and minimizes operator interaction  saving time and cost. The software includes multi-touch controls and 3D image visualization
tools, taking ease-of-use to a whole new level. 

  • Enables Fast Set-Up
  • From Gerber in ~10 – 20 min.
  • From OBD++ ~5 – 10 min.

AI2 – Faster, Smarter Programming

AI2 (Autonomous Image Interpretation) technology is all about keeping it simple – no parameters to adjust or algorithms to tune. And, you don’t need to anticipate defects or pre-define variance either – AI2 does it all for you. With AI2, you have the power to inspect the most comprehensive list of features and identify the widest variety of defects. AI2 offers precise discrimination with just one panel inspection making it a perfect solution for high-mix and high-volume applications

Defect Review

 

CyberReport™ A Complete SPC Solution

Provides full-SPC solution with historical analysis and reporting tools with complete traceability. Effective process verification and control to improve yields.

  • CyberReport Data Output
  • Intuitive interface for minimal training.
  • Provides a robust and scaleable, compact database.
  • Fast parsing and charting speed.

 

Technical Data

Technical Data for the Cyber Optics SE 3000-D

BROCHURE
System Specifications
Panel Size Capacity (Min)  50 x 50 mm (2.0 x 2.0 in.)
Panel Size Capacity (Max)
Single Lane (SL) Mode 510 x 510 mm (20.0 x 20.0 in.)
Dual Lane (DL) Mode 510 x 300 mm (20.0 x 11.8 in.)
System Dimensions (W x D x H) 168 x 162 x 158 cm
Weight  ≈ 1550 kg (3417 lbs.)
Maximum Panel Weight  3.0 kg (6.6 lbs)
Board Thickness  0.3 mm to 5.0 mm (0.01 in. to 0.2 in.)
Board edge clearance  3.0 mm (0.12 in.)
Component Clearance Top (above belt): 20.1 mm (0.78 in.); Bottom: 35 mm (1.37 in.)
Conveyor Speed Range 150 – 450 mm/sec (5.9 – 17.7 in./sec
Functional Specifications
Maximum Inspection Area
Single Lane (SL) Mode 508 x 503 mm (20.0 x 19.8 in.)
Dual Lane (DL) Mode 508 x 294 mm (20.0 x 11.6 in.)
Conveyor Mode Asynchronous / Synchronous
X and Y Pixel Size High Resolution: 9 μm; High Speed: 18 μm
Height Resolution 0.2 μm (0.008 mils)
Maximum Board Warp < 2% of PCB diagonals or max. of 6.35mm (0.25 in) total
Maximum Pad Size in FOV  15 x 15 mm ( 0.6 x 0.6 in.)
Measurement Types Height, Area, Volume, Registration, Bridge Detection
Machine Interface SMEMA, RS232 & Ethernet
Power Requirements 100 – 130 / 220 – 240V, 50/60 Hz, 10 – 15 amps
Compressed Air Requirements 5.6 to 7.0 Kgf/cm² (80 to 100 psi @ 4 cfm)
Performance Specifications
Inspection Speeds
– @ 18 μm (High Speed) 45 cm²/sec
– @ 9 μm (High Resolution) 17 cm²/sec
Height Accuracy †  2 μm on a Certification Target
Gage R&R † <<10%, 6 σ
† Under controlled conditions
Options
SPC software, Barcode Readers (1D/2D), Programming Software: ePM-SPI/AOI & GC-PowerPlace, Offline Defect Review, Certification Target
SE3000, SE3000-X (Large Board Capability) and SE3000-DD (Dual Lane – Dual Sensor) models are available