Cyber Optics SE3000


Description

 

SE3000 SPI – A Leap Forward in Solder Paste Inspection

Delivers Unmatched Metrology Grade Inspection at Production Speed

  • Ultimate 3D Inspection Results
    • Best accuracy, repeatability and reproducibility
    • Inhibits reflection issues with advanced MRS sensing
    • AI2 inspection
  • Fastest 3D Inspection in the Industry
    • Maximizes ROI and line utilization with architecturally faster sensor than competition
    • Achieves microscopic image quality at product speed, enabled by Multi-reflection Suppression (MRS) technology
  • Easy-to-Use with Simple Intuitive Interface
    • Offers superior quality 3D image visualization with touch control
    • Reduces training & labor costs
    • Lowers programming maintenance and interaction

 

The SE3000 3D SPI is powered by CyberOptics’ breakthrough 3D sensing technology comprising of two MRS Sensors delivering metrology grade accuracy at production speed. CyberOptics’ unique sensor architecture simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together. The result is ultra-high quality 3D images and high-speed inspection.

 

MRS Sensor Technology

  • Industry-leading sensor technology now integrated into SPI

Phase Shift Profilometry

  • Sensor – Structured White Light
  • Measurement – Advanced Optical Triangulation

High Speed On-the-Fly Inspection

Single Illumination Sensor Dual Illumination Sensor

Speed, Performance Accuracy, Shadow Free

Continuous image acquisition delivering high accuracy and consistent repeatability

Intuitive, Easy-to-Use Software

The SE3000 software is a powerful yet extremely simple
design with an intuitive interface that reduces training efforts and minimizes operator interaction  saving time and cost. The software includes multi-touch controls and 3D image visualization
tools, taking ease-of-use to a whole new level. 

  • Enables Fast Set-Up
  • From Gerber in ~10 – 20 min.
  • From OBD++ ~5 – 10 min.

AI2 – Faster, Smarter Programming

AI2 (Autonomous Image Interpretation) technology is all about keeping it simple – no parameters to adjust or algorithms to tune. And, you don’t need to anticipate defects or pre-define variance either – AI2 does it all for you. With AI2, you have the power to inspect the most comprehensive list of features and identify the widest variety of defects. AI2 offers precise discrimination with just one panel inspection making it a perfect solution for high-mix and high-volume applications

Defect Review

 

CyberReport™ A Complete SPC Solution

Provides full-SPC solution with historical analysis and reporting tools with complete traceability. Effective process verification and control to improve yields.

  • CyberReport Data Output
  • Intuitive interface for minimal training.
  • Provides a robust and scaleable, compact database.
  • Fast parsing and charting speed.

 

Technical Data

Technical Data for the Cyber Optics SE 3000

BROCHURE
Inspection Capabilities MRS Sensor Ultra High Resolution MRS Sensor
Inspection Speed Peak: 35 cm2/sec (2D+3D)
Average: 30 cm2/sec (2D+3D)
Peak: 15 cm2/sec (2D+3D)
Average: 12 cm2/sec (2D+3D)
Minimum Component Size 0402 mm (01005 in.) 0201 mm (008004 in.)
PCB Size 510 x 510 mm (20 x 20 in.)
Panel Size Capacity (Min) 50 x 50 mm (2.0 x 2.0 in.)
Maximum Panel Weight 3.0 kg (6.6 lbs)
PCB Thickness 0.3 mm to 5.0 mm (0.01 in. to 0.2 in.)
Board Edge Clearance Top: 2.5 mm (0.10 in.) ; Bottom: 3.0 mm (0.12 in.)
Clearance Top (above belt): 30 mm (1.18 in.) ; Bottom: 35 mm (1.38 in.)
Conveyor Speed Range 150 – 450 mm/sec (5.9 – 17.7 in./sec)
Conveyor Adjustment Automatic
Functional Specifications
Maximum Inspection Area 508 x 503 mm (20.0 x 19.5 in.)
Field-of-View (FOV) 36 x 36 mm (1.42 x 1.42 in.) 22 x 22 mm (0.87 x 0.87 in)
3D Resolution 18 μm 9 μm
Maximum Board Warp < 2% of PCB diagonals or max. of 6.35mm (0.25 in) total
Maximum Pad Size in FOV 15 x 15 mm ( 0.6 x 0.6 in.)
Measurement Types Height, Area, Volume, Registration, Bridge Detection, Defect Review
Measurement Gage R&R <10%, 6 σ on Printed Circuit Board;
<5% 6 σ on Certification Target
<5%, 6 σ on Printed Circuit Board;
<3% 6 σ on Certification Target
Height Accuracy 2 μm on a Certification Target
Height Measurement Range 1 mm
Vision System & Technology
Imagers Multi-3D sensors
System Specifications
Machine Interface SMEMA, RS232 and Ethernet
Power Requirements 100-120 VAC or 220-240 VAC, 50/60 hz, 10 amp max.
Compressed Air Requirements 5.6 to 7.0 Kgf/cm² (80 to 100 psi @ 4 cfm)
System Dimensions 110 x 127 x 139 cm (W x D x H)
Weight ≈965 kg (2127 lbs.)
Options
SPC software, Barcode Readers (1D/2D), Programming Software: ePM-SPI/AOI & GC-PowerPlace, Offline Defect Review, Certification Target
SE3000-D (Dual Lane), SE3000-DD (Dual Lane – Dual Sensor) and SE3000-X (Large Board Capability) models are available