Cyber Optics SQ3000


Description

SQ3000 Multi Function – All in One

  • Supports multiple applications for Automated Optical Inspection, Solder Paste Inspection, and Coordinate Measurement without hardware or software changes
  • Delivers unmatched metrology grade inspection at production speed, enabled by Multi-reflection Suppression (MRS) Technology
  • Reduces engineer/ operator training/ set up times
  • Maximizes ROI and line utilization with architecturally faster sensor than competition
The SQ3000 is powered by CyberOptics’ breakthrough 3D sensing technology comprising of two MRS Sensors delivering metrology grade accuracy at production speed. CyberOptics’ unique sensor architecture simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together. The result is ultra-high quality 3D images and high-speed inspection.

 

  • SQ3000 3D AOI Key Features
    • 100% 2D & 100% 3D image acquired in every FOV
    • Extensive suite of inspection & measurement tools
    • 24mm height range in 3D for tall parts
    • Statistical appearance / shape analysis in 2D & 3D
    • Supports SMT, PTH, Selective, Wave, Micro, Wire bond
    • 0.5 micron height resolution / Very accurate measurements
  • SQ3000 3D AOI MeasurementS
    • Component height
    • Coplanarity
    • Part verification / OCR / Polarity
    • Lead / pin height / position
    • Solder joint area / volume
    • Solder bridge
    • Contamination
    • Geometry measurement
    • SMT, PTH, Selective, Micro, Wire bond
    • Height range 0 – 24mm

 

  • SQ3000 3D SPI Key Features

    • Fast set up typically 10 – 15 minutes
    • Zero calibration no drift no maintenance
    • Import Gerber, ODB++, JSON
    • Linear drive and encoder
    • 0.5 micron height resolution
    • Contamination / Solder splash and ball measurement 2D/3D
  • SQ3000 3D SPI Measurements
    • Paste height
    • Paste area
    • Paste volume
    • X,Y, Offset
    • Insufficient, excessive paste
    • Paste bridge
    • Contamination
    • Paste shape
    • Height range 0 – 24mm

 

 

  • SQ3000 3D CMM Key Features

    • Extremely fast measurement of small / complex parts
    • Very accurate measurements to 2um on product
    • Fast set up & verification for in-process or off-line
    • 3D image data output to STL / PLY file for Metrology analysis
    • STL / PLY file output to 3D printer
    • Automatic report generation based on PMI / CAD data
  • SQ3000 3D CMM Measurement Tools
    • Line / Distance / X,Y / Mid Line
    • Inter Point / Regression / Shifted
    • Datum X,Y / LSF X,Y Offset
    • X,Y Offset / Value / Location / List of X,Y Values
    • Height / Local Height / Regression / Radius
    • Coplanarity / Distance to plane / 2nd Order fitting
    • Difference / Absolute /  2sqrt / VC
    • Max / Min / Ave / Sigma / Plus / Minus / Multiply

 

 

SQ3000 applications

 

Packaging

  •  Characteristic
    • Small component and High component density
    • > 30K tasks
    • Shiny component
  • Key to winning
    • 2D/3D image performance for shiny/small component
    • Gap measurement between Components
    • Repeatable 2D/3D measurement
    • Factory automation

 

Through hole

  • Key to winning
    • 3D image performance on Shiny solder
    • Shape inspection – 3D AI2

 

Keyboard Assembly

  • Key to winning
    • 2D/3D image performance
    • Line distance measurement
    • Diameter measurement
    • Flatness measurement

 

Mobile phone SMT

  • Key to winning
    • 3D image performance
    • Reliable x/y offset measurement – 2D AI2
  • Key to winning
    • 2D/3D image performance
    • Line distance/angle measurement
    • Coplanarity measurement
  • Text inspection
    • 2D lighting performance
    • AI2performance
    • Image pre-processing
  • Shiny component

 

Automotive SMT

  • Gap measurement of “tuning fork”
  • Alignment of the 2 sides of the “tuning fork” – 2D/3D AI2
  • Tall components text inspection
  • Tall component
  • 3D Image performance on connector pins
  • Cycle time
  • Multi-height boards
  • 2D/3D image performance
  • Line distance/angle measurement
  • x/y offset repeatability (AI2)
  • Height measurement

 

 

Home appliance SMT

  • Tall component
  • Cycle time
  • Side inspection capability for HDMI, USB and connectors
  • Board size and warpage

 

Memory SMT

  • 2D/3D Inspection capability (2D/3D AI2, 3D measurement)
  • Gold finger inspection
  • Cycle time
  • Programming UI and time
  • Library management
  • Valor programming

 

Medical SMT

  • Less than 10um lift defect inspection
    • Inspection using 2D AI2
    • Defect verification using side camera
  • Traceability
    • Reading barcode on tall component
    • Image performance
    • Zero escape

 

SOP (Solder on Pad)

  • 3D Image performance on shiny bump
  • Volume/Height measurement repeatability

Solder ball

  • Image performance
  • Volume/Height measurement repeatability
  • Easy programming

 

Semiconductor

 

Wafer

  • 2D/3D Image performance on the front and back side of wafer
  • Small debris detection (2D-AI2)
  • Coplanarity

 

Die & Wire Bond Inspection

Inspection requirements

  • Defect detection:
    • Disturbed wire
    • Sagging wire
    • Wire sway
    • Wire short
    • Broken wire
    • Missing wire
    • Missing ball
    • Misplaced stitch
    • Lifted bond
    • Scratched die
    • Cracked die
    • Contamination
  •  
  • Measurement Capability:
    • Wire Loop Height

 

 

Confocal example, intensity                                              Confocal example, height

Die Defect

crack                                                         scratch

missing wire                                          wire short
broken                                     sway                            sagging
 
mispleced ball                                        misplaced stich

 

Led Inspection

Thickness measurement with a confocal chromatic sensor

  • Examples of applications
    • Sensor: Chrocodile 2S
    • Probe: 3 mm
    • Scan area: 12mm x 18mm
    • Z range: 1mm
    • X/Y resolution: 20µm x 20µm
    • Measurement time: NA
    • Measurement speed: 20KHz

 

LED Requirement

  • Mini LED, size 200um x 200um x 80um
  • Measure, XY Position, In-Plane Angle, Tilt Angle
  • Inspect Polarity

 

 

Technical Data

Technical Data for the Cyber Optics SQ 3000

 

SQ3000 3D AOI   SQ3000 3D CMM SQ3000-X Large Board Capability SQ3000 Semiconductor Applications SQ3000 Multi-Process

 

Inspection Capabilities MRS Sensor Ultra High Resolution MRS Sensor
Inspection Speed 40 cm2 /sec (2D+3D), High Speed option available: 50 cm2 /sec (2D+3D) 15 cm2 /sec (2D+3D)
Minimum Component Size 0402 mm (01005 in.) 0201 mm (008004 in.)
PCB Size 510 x 510 mm (20 x 20 in.)
Component Height Clearance Top: 50 mm Bottom: 30mm
PCB Thickness 0.3 – 5 mm
Component Types Inspected Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and more
Component Defects Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more
Solder Joint and Other Defects Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins
3D Measurement Inspection Lifted Lead, package coplanarity, polarity dimple and chamfer identification
Measurement Gage R&R <10% @ ±3σ (±80 µm process tolerance)
Z Height Measurement Range 6 mm at spec, 24 mm capability 3 mm at spec, 10 mm capability
XY Resolution 10 µm 7 µm
Z Resolution 1 µm 1 µm
Maximum Weight SQ3000: 3 kg (5 kg Option), SQ3000-X: 10 kg
Minimum Feature Size 10 µm 7 µm
Minimum Feature Height 2 µm 2 µm
Maximum Feature Size SQ3000: 510 x 510 mm (20 x 20 in.), SQ3000-X: 710 x 610 mm (27.9 x 24 in.)
Maximum Feature Height 24 mm 10 mm
XY R&R < 3 µm 1 sigma < 2 µm 1 sigma
Z R&R < 2 µm 1 sigma < 2 µm 1 sigma
Accuracy XY 3 µm 2 µm
Accuracy Z 2 µm 2 µm
Height Clearance Top: 50 mm, Bottom: 30 mm
Carrier Thickness 0.3 – 5 mm (10 mm Option)
Coordinate Measurement Capability Line / Distance / X,Y / Mid Line, Inter Point / Regression Shifted, Datum X,Y / LSF X,Y Offset,X,Y Offset / Value / Location / List of X,Y Values, Height / Local Height / Regression / Radius,Coplanarity/ Distance to plane / 2nd Order fitting, Difference / Absolute / 2sqrt / VC, Max / Min /Ave / Sigma / Plus / Minus / Multiple
Vision System & Technology
Imagers Multi-3D sensors
Resolution Sub 10 µm 7 µm
Image Processing Autonomous Image Interpretation (AI2 ) Technology, Coplanarity and Lead Measurement
Programming Time  <15 minutes (for established libraries)
CAD Import Any column-separated text file with ref designator, XY, Angle, Part no info; Valor process preparation
System Specifications
Machine Interface SMEMA, RS232 and Ethernet
Power Requirements 100-120 VAC or 220-240 VAC, 50/60 hz, 10 amp max.
System Dimensions 110 x 127 x 139 cm (W x D x H)
Weight ≈965 kg (2127 lbs.)
Options
Barcode Reader, Rework station, SPC Software, Alignment Target
SQ3000-X (Large Board Capability), SQ3000-D (Dual Lane), and SQ3000-DD (Dual Lane – Dual Sensor) models available