Cyber Optics SQ3000-DD

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Description

SQ3000-DD – Maximum Capability for Increased Throughput

  • Ideal for inspecting high volume assemblies
  • Convenience of inspecting different assemblies and board sizes simultaneously, on different lanes
  • Or Switching from dual lane to single lane to inspect very large boards
  • Choose between 2 of the same or 2 different MRS sensors
The SQ3000-DD™ is powered by CyberOptics’ breakthrough 3D sensing technology comprising of two MRS Sensors delivering metrology grade accuracy at production speed. CyberOptics’ unique sensor architecture simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing algorithms merge the images together. The result is ultra-high quality 3D images and high-speed inspection.

Intuitive, Easy-to-Use Software

The SQ3000-DD™ software is a powerful yet extremely simple
design with an intuitive interface that reduces training efforts and minimizes operator interaction  saving time and cost. The software includes multi-touch controls and 3D image visualization
tools, taking ease-of-use to a whole new level.

AI2 – Faster, Smarter Programming

AI2 (Autonomous Image Interpretation) technology is all about keeping it simple – no parameters to adjust or algorithms to tune. And, you don’t need to anticipate defects or pre-define variance either – AI2 does it all for you. With AI2, you have the power to inspect the most comprehensive list of features and identify the widest variety of defects. AI2 offers precise discrimination with just one panel inspection making it a perfect solution for high-mix and high-volume applications

Alternative High Speed, Serial Configuration 2x Single Lane

  • New system hardware.
  • Dual track, Dual sensor, Dual Gantry, Dual PC
  • Any combination of product for Lane 1, Lane 2.
  • Different sensor combinations may be mounted.

 

Alternative High Speed, Serial Configuration 2x Single Lane

  • New system hardware.
  • Dual track, Dual sensor, Dual Gantry, Dual PC
  • Any combination of product for Lane 1, Lane 2.
  • Different sensor combinations may be mounted.

 

CyberOptics’ unique sensor architecture with multi-view 3D sensors and a parallel projector, simultaneously captures and transmits multiple images in parallel while proprietary 3D fusing
algorithms merge the images together, delviers metrology grade accuracy at production speed.
The dual lane system maximizes flexibility catering to varying PCB widths. This unique design provides the ability to inspect high volume assemblies, the convenience of inspecting different assemblies and board sizes on different lanes, or even switching
from dual lane to single lane mode to inspect very large boards.

Flexibility At Its Best

The SQ3000-DD™ 3D Automated Optical Inspection (AOI) System is an extension of the award-winning SQ3000™ 3D AOI platform. The dual lane, dual sensor system maximizes flexibility catering to varying PCB widths. This unique design provides the ability to inspect high volume assemblies, the convenience of inspecting different assemblies and board sizes simultaneously on different lanes, or even switching from dual lane to single lane mode to inspect very large boards.
Not only does the SQ3000-DD™ provide PCB flexibility, it also provides the flexibility to choose two of the same or two different proprietary MRS sensors

 

 

Technical Data

Technical Data for the Cyber Optics SQ 3000-DD

BROCHURE
Inspection Capabilities MRS Sensor Ultra High Resolution MRS Sensor
Inspection Speed 40 cm2 /sec (2D+3D), High Speed option available: 50 cm2 /sec (2D+3D) 15 cm2 /sec (2D+3D)
Minimum Component Size 0402 mm (01005 in.) 0201 mm (008004 in.)
PCB Size Single Lane: 510 x 510 mm (20 x 20 in.)
Dual Lane: 510 x 330 mm (20 x 13 in.)
Component Height Clearance Top: 50 mm Bottom: 30mm
PCB Thickness 0.3 – 5 mm
Component Types Inspected Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and more
Component Defects Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more
Solder Joint and Other Defects Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins
3D Measurement Inspection Lifted Lead, package coplanarity, polarity dimple and chamfer identification
Measurement Gage R&R <10% @ ±3σ (±80 µm process tolerance)
Z Height Measurement Range 6 mm at spec, 24 mm capability 3 mm at spec, 10 mm capability
Vision System & Technology
Imagers Multi-3D sensors
Resolution Sub 10 µm 7 µm
Image Processing Autonomous Image Interpretation (AI2 ) Technology, Coplanarity and Lead Measurement
Programming Time  <15 minutes (for established libraries)
CAD Import Any column-separated text file with ref designator, XY, Angle, Part no info; Valor process preparation
System Specifications
Machine Interface SMEMA, RS232 and Ethernet
Power Requirements 100-120 VAC or 220-240 VAC, 50/60 hz, 10 amp max.
System Dimensions 170.5 x 162 x 152 cm (W x D x H) Height excludes signal-light pole and leveling feet
Weight ≈1596 kg (3519 lbs.)
Options
Barcode Reader, Rework station, SPC Software, Alignment Target
SQ3000-X (Large Board Capability), SQ3000-D (Dual Lane), and SQ3000-DD (Dual Lane – Dual Sensor) models available

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