| Inspection Capabilities |
MRS Sensor |
Ultra High Resolution MRS Sensor |
| Inspection Speed |
40 cm2 /sec (2D+3D), High Speed option available: 50 cm2 /sec (2D+3D) |
15 cm2 /sec (2D+3D) |
| Minimum Component Size |
0402 mm (01005 in.) |
0201 mm (008004 in.) |
| PCB Size |
510 x 510 mm (20 x 20 in.) |
|
| Component Height Clearance Top: |
50 mm Bottom: 30mm |
|
| PCB Thickness |
0.3 – 5 mm |
|
| Component Types Inspected |
Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header pins, and more |
|
| Component Defects |
Missing, polarity, tombstone, billboard, flipped, wrong part, gross body and lead damage, and more |
|
| Solder Joint and Other Defects |
Gold finger contamination, excess solder, insufficient solder, bridging, through-hole pins |
|
| 3D Measurement Inspection |
Lifted Lead, package coplanarity, polarity dimple and chamfer identification |
|
| Measurement Gage R&R |
<10% @ ±3σ (±80 µm process tolerance) |
|
| Z Height Measurement Range |
6 mm at spec, 24 mm capability |
3 mm at spec, 10 mm capability |
| XY Resolution |
10 µm |
7 µm |
| Z Resolution |
1 µm |
1 µm |
| Maximum Weight SQ3000: |
3 kg (5 kg Option), SQ3000-X: 10 kg |
|
| Minimum Feature Size |
10 µm |
7 µm |
| Minimum Feature Height |
2 µm |
2 µm |
| Maximum Feature Size SQ3000: |
510 x 510 mm (20 x 20 in.), SQ3000-X: 710 x 610 mm (27.9 x 24 in.) |
|
| Maximum Feature Height |
24 mm |
10 mm |
| XY R&R |
< 3 µm 1 sigma |
< 2 µm 1 sigma |
| Z R&R |
< 2 µm 1 sigma |
< 2 µm 1 sigma |
| Accuracy XY |
3 µm |
2 µm |
| Accuracy Z |
2 µm |
2 µm |
| Height Clearance Top: |
50 mm, Bottom: 30 mm |
|
| Carrier Thickness |
0.3 – 5 mm (10 mm Option) |
|
| Coordinate Measurement Capability |
Line / Distance / X,Y / Mid Line, Inter Point / Regression Shifted, Datum X,Y / LSF X,Y Offset,X,Y Offset / Value / Location / List of X,Y Values, Height / Local Height / Regression / Radius,Coplanarity/ Distance to plane / 2nd Order fitting, Difference / Absolute / 2sqrt / VC, Max / Min /Ave / Sigma / Plus / Minus / Multiple |
| Vision System & Technology |
| Imagers |
Multi-3D sensors |
|
| Resolution |
Sub 10 µm |
7 µm |
| Image Processing |
Autonomous Image Interpretation (AI2 ) Technology, Coplanarity and Lead Measurement |
|
| Programming Time |
<15 minutes (for established libraries) |
|
| CAD Import |
Any column-separated text file with ref designator, XY, Angle, Part no info; Valor process preparation |
|
| System Specifications |
| Machine Interface |
SMEMA, RS232 and Ethernet |
|
| Power Requirements |
100-120 VAC or 220-240 VAC, 50/60 hz, 10 amp max. |
|
| System Dimensions |
110 x 127 x 139 cm (W x D x H) |
|
| Weight |
≈965 kg (2127 lbs.) |
|
| Options |
| Barcode Reader, Rework station, SPC Software, Alignment Target |
|
| SQ3000-X (Large Board Capability), SQ3000-D (Dual Lane), and SQ3000-DD (Dual Lane – Dual Sensor) models available |
|
