Cyber Optics MX600


Memory Module Inspection MX600

Automated Final Vision Inspection
Best Performance + Lower Cost of Ownership

• Automated Final Vision Inspection for singulated memory modules
• Simultaneous dual-sided inspection with High Resolution (12μm) SIM enabling 50% productivity improvement.
• Production Ready in <13 minutes† with AI2
• 0201 Inspection Capability
• Lowest False Call Rate and Zero Escapes
• In line multiple module gripper to minimize handling tact time
• Traceability features
• S2/S8 compliance

Intelligent Sensing Technology

The SIM (Strobed Inspection Module) is the core engine behind every MX600TM system enabling ‘on-the-fly’ high performance inspection.
Designed and manufactured exclusively by CyberOptics, the SIM is absolutely calibration-free and illuminates only when needed – reducing cost of ownership and power consumption.
The dual SIMS provide a single platform for the inspection and defect review process that shortens the production line and drives ~50% productivity improvement. The SIM on the MX600 is designed with enhanced illumination – delivering the best 0201 and final vision inspection performance ever. With an 80 Megapixel sensor and higher resolution (12 μm), you get crisp, perfect quality images for more accurate defect review.

3-Easy-Steps Programming

Our latest software improvements take programming to a whole, new level – zero to production ready in less than 13 minutes! All this is made possible, with an all-new data-rich, pre-loaded library and automated scripts that collect examples and update models – all on their own.

Post-Test Defect Types, Pre-Shipping Inspection

Inspection Capability includes:
– Components Edge
– Damage PCB Corner
– Goldfinger Discolored / Burnt / Badly Scratched
– Gold tab inspection – Lifted tie bar, burnt, contamination
– Physically Damaged Components

Inspect ‘Anything’

CyberOptics’ AI2 (Autonomous Image Interpretation) technology is designed for both low volume high mix, and high volume low mix Applications, and builds on the proven success of our Statistical Appearance Modeling technology. AI2 is all about keeping it simple – no parameters to adjust or algorithms to tune.
And, you don’t need to anticipate defects or pre-define variance either – AI2 does it all for you. Just draw a box, show a few good examples and you are
ready to inspect just about anything. Simply add good
examples to the Ai2 model and the false call rates reduce
significantly providing a very robust inspection solution.

AI2  – Faster, Simpler, and Smarter

With AI2 technology, programming gets even faster – with a 90% reduction in examples required – so you get superior defect detection and low false call rates even with just one example. This means significantly lower tuning time and quality results with one panel inspection. Perfect for those high-mix or low volume applications! 
With its unique ability to ‘ignore’ bad examples in a model, AI2 offers precise discrimination even with excessive variance and minimizes effects of outlier examples.
Plus, it is a lot simpler with full support for unsupervised and semiautomatic model training. And, examples are pre-sorted so you can
select and clear the ones you don’t need – very quickly.
The pixel marking feature highlights defective spots, so you can
identify genuine defects instantly.

Fast, Scalable SPC Solution

CyberReportTM offers full-fledged machine-level to factory-level SPC capability with powerful historical analysis and reporting tools delivering complete traceability for process verification and yield improvement. CyberReportTM is easy to setup and
simple to use while providing fast charting with a compact database size.



Technical Data

Technical Data for the Cyber Optics MX600™



Inspection Capabilities
Inspection Speed 110 cm2/sec
Minimum Component Size 0201 mm
Board Length Min. 25 mm / Max. 170 mm
Board Width Min. 17 mm / Max. 110 mm
Component Height Clearance (max) 35mm
Board Edge Clearance (min) 5.0 mm
Maximum Board Weight  3 kg
Maximum Board Warp  Up to +/- 3 mm
Component Types Inspected Standard SMT (chips, J-lead, gull-wing, BGA, etc.), through-hole, odd-form, clips, connectors, header,pins, and more
Solder Joint Defects Categories Solder bridge, opens, lifted leads, wettability, excess and insufficient solder, debris, and more
Other Items Detected Gold-finger contamination, pin-in-hole, bent pins, debris, and many others
Component Measurement Categories Component X, Y position and Rotation
Vision System
Imagers 80 Megapixel Sensor on each SIM module
Image Transfer Protocol PCIe
Lighting Strobe White Light (with dark/bright field)
Resolution  12 μm pixel size
Image Processing Statistical Appearance Modeling (SAM™ ) Technology. Option: Autonomous Image Interpretation (AI²) Technology
Programming Simple inline or offline
CAD Import Any column separated text file (Standard information required – ref designator, XY, Angle, Part no.,)
System Specifications
Power Requirements AC 220V, 3 phase, 60 Hz, 4 wire, Amp: 50A
System Dimensions 2.5m x 2.75m x 2.05 m
Weight 4.5 tons
SPC Software, Alignment Target