Description

X-Ray Inspection with X Line · 3D

The X Line · 3D is an inline AXI system for high-end inspection in mass production. It is used for quality assurance in complex and high-quality assemblies at a high testing speed.

The three-dimensional X-ray inspection captures both the top and bottom sides within a continuous process. By combining X-ray inspection (AXI) with an AOI module, inspection tasks can also be carried out which are not possible using X-ray alone (AXOI).

The system is available in various speed configurations and can be adapted to the customer-specific test strategies by means of two different image acquisition concepts.

Programming Software – PILOT AXI

… a software for AXI test program generation. The inspection process wizard allows fast and intuitive programming. The offline programming concept reduces machine downtimes.

extensive AXI/AXOI component library
CAD data import (ODB++, GenCAD, Gerber data, insertion data)
integrated debugging statistics for fast optimization of inspection programs
full offline programming away from the production line
intelligent data management for storing test results
numerous test functions for X-ray and AOI inspection

Machine Control Software – PILOT Inspect

… a machine control software for unified control of GOEPEL electronic inspection systems. The touch screen operating concept for accessing apps provides intuitive handling as well as clear and structured presentation of the most important information.

operation and control of inspection systems via system PC as well as on mobile devices
short training time through integrated information texts and video tutorials
software based on various apps (for example inspection, fault statistics, calibration, machine state)
- status display on PILOT Inspect start page
reduced machine downtimes through targeted fault diagnosis with status display and troubleshooting hints
interaction with sofware module Pilot Connect
communication with MES systems

Image capturing chain: X-ray tube

Microfocus x-ray tube
Spot size: typ. 5µm – 10µm
Sealed type, maintenance free
Max. voltage: 130kV
Max. current: 300µA
Real-time multi angle detector
Simultaneous image capturing from different angles
Synchronously hardware based image integration for low noise
Spatial resolution: 10µm to 35µm
Greyscale resolution: 12 Bit

Technical Data

AXI · Technology
X-ray inspection

X Line · 3D, X Line · 2D

BROCHURE

System
in-line interface	SMEMA, Siemens
device connections	230 VAC, 1 kVA, 6 bar compressed air, < 20 Nl/min *
typical power consumption	< 700 W (average)
dimensions (wxdxh) base unit:	1596 mm x 1540 mm x 1470 mm device with tube tower: 1596 mm x 1540 mm x 1720 mm
weight	approx. 2.5 t
PCB handling
transport height	850 mm – 950 mm ± 25 mm
width adjustment	automatic
PCB size (lxw)	max. 450 mm x 400 mm – min. 60 mm x 50 mm
PCB thickness	0.5 mm – 5 mm
PCB contact width	≥ 3 mm
PCB weight	≤ 1.5 kg
PCB deflection	automatic compensation (laser)
component clearance of PCB	below: 65 mm – above: max. 40 mm
handling time	approx. 5 s (parallel loading/unloading and inspection)
X-ray technology
tube type	zero-maintenance, sealed micro-focus X-ray tube
tube voltage	max. 130 kV
tube current	max. 300 μA
tube output	max. 39 W
detector type	multi-angle detector, real-time image capture from different angles
grey-scale resolution	12 bits
detail resolution	variable: 6 μm – 24 μm
3D process	digital tomosynthesis
3D inspection speed	X Line · 3D X10: up to 10 cm²/s
	X Line · 3D X40: up to 40 cm²/s \| X Line · 3D X40PLUS: > 40 cm²/s
calibration	geometric and grey-value calibration, automatic stability monitoring 3
z-axis adjustment	customisable geometrical magnification by means of motorised vertical positioning of the tube
X-ray protection	in accordance with the German X-ray Ordinance RöV, three segments, radiation-proof, zero emissions
Optical image capture technology
resolution	21 μm
field of view	42 mm x 42 mm
lens	telecentric (pixel-adaptive objective)
lighting	multi-spectral lighting, selectable from blue to IR

Göpel X Line · 3D

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