|type 523||type 634||type 734||type 834||type 934||type 944|
|DIMENSIONS AND WEIGHTS|
|Length||4990 mm||6040 mm||6390 mm||6740 mm||7090 mm||7440 mm|
|Height (at transport height 900 mm)||1570 mm|
|Height with open hoods (at transport heigth 900 mm)||ca 1900 mm|
|Required area||7,86 m2||9,52 m2||10,07 m2||10,62 m2||11,17 m2||11,72 m2|
|Weight (according to options up to 500 kg / 1100 lb more)||ca. 3300 kg||ca. 3600 kg||ca. 3900 kg||ca. 4100 kg||ca. 4400 kg||ca. 4600 kg|
|Load per unit area||400 kg/m2|
|PROCESS CHAMBER HEATING|
|Length||2450 mm||3150 mm||3500 mm||3850 mm||4200 mm||4550 mm|
|Quantity of preheating zones||5||6||7||8||9||9|
|Length of preheating zones||1750 mm||2100 mm||2450 mm||2800 mm||3150 mm||3150 mm|
|Quantity of peak zones||2||3||3||3||3||4|
|Length of peak zones||700 mm||1050 mm||1050 mm||1050 mm||1050 mm||1400 mm|
|Max. permissible soldering temperature : preheating zones||300 °C|
|Max. permissible soldering temperature : peak zones||350 °C|
|Heat transfer through||Forced convection|
|Gas circulation per heating zone||max. 350 m3/h|
|Warm up time||ca. 30 min / approx 30 min|
|Cross profile (Delta T = Tmax _ Tmin)||± 2,5 Kelvin|
|Length||1050 mm||1400 mm||1400 mm||1400 mm||1400 mm||1400 mm|
|PIN CHAIN CONVEYOR|
|Transport Level||900 mm ±75 mm|
|Width, single conveyor ±0,5 mm / without CBS||Standard: 50 mm – 400 mm|
|Option 1: 50 mm – 460 mm|
|Option 2: 50 mm – 508 mm|
|Width, single conveyor ±0,5 mm / with CBS||Standard: 65 mm – 400 mm|
|Option 1: 100 mm – 460 mm|
|Option 2: 140 mm – 508 mm|
|Width, dual conveyor ±0,02 in||65 mm – 213 mm (216 mm)|
|Clearance above the conveyor||30 mm|
|Pin chain support width||Standard 3 mm, optional 5 mm|
|Tolerance conveyor speed (1 % per 1800 mm/min)|
|Lash heigt||Lash stand off: 16mm|
|Distance to fixed rail lowered||20 mm|
|Center Support active Width||Standard: 50 mm – 340 mm|
|Option 1: 50 mm – 380 mm|
|Option 2: 50 mm – 390 mm|
|CBS Low (Parking Position)||14 mm|
|Maximum noise level||70 dBA|
|Room temperature||between 59 F and 89,6 F|
|Humidity||between 30 % and 75 %|
|Oxygen of peak zones||< 100 ppm|
|VOLTAGE SUPPLY CONSUMPTION|
|Type of power system||5-Wire-System|
|Connected load||58 KW||73 KW||78 KW||82 KW||87 KW||97 KW|
|Voltage supply||3 x 400 VAC ± 5 % 50 Hz / other voltages upon request|
|COOLING WATER AT EXTERNAL COOLING|
|Connection||M 28 x 1,5 (22 mm Cu Rohr / 0,87 in Cu Tube)|
|Cooling water flow||between 10 – 20 l/min (according to temperature)|
|Operating pressure||min. 2 bar – max. 5 ba|
|Differential pressure between forward and return run||min. 0,5 bar|
|Connection||M 16×1 (12 mm Cu Rohr) / M 16×1 (12 mm / 0,472 in Cu Tube)|
|Nitrogen supply pressure||min. 7 bar – max .8 bar|
|Operating pressure||5 bar|
|Nitrogen consumption single conveyor at < 200 ppm in peak at min. 1 PCB gap||ca. 20 m3/h||ca. 21 m3/h||ca. 21 m3/h||ca. 22 m3/h||ca. 23 m3/h||ca. 25 m3/h|
|Nitrogen consumption double conveyor at < 200 ppm in peak zone at min. 1 PCB gap||ca. 22 m3/h||ca. 22 m3/h||ca. 23 m3/h||ca. 24 m3/h||ca. 25 m3/h||ca. 27 m3/h|
|Exhaust socket: diameter||150 mm|
|Exhaust at min. 5 mbar underpressure||400 m3/h|
|Exhaust temperature||< 50°C|
|COMPRESSED AIR PROCCESS CHAMBER|
|Compressed air||min. 7 bar – max .8 bar|
VisionXP+ Number one in the process
Reflow convection soldering is now even more efficient, more sustainable and easier to maintain! Rehm Thermal Systems presents the VisionXP+ with new features, such as energy-efficient EC fan motors, improvements in the cooling zone, and further developments in design and comprehensive operation data collection.
The Transport System
Our flexible system saves you money. Maintenance and downtime are reduced by means of a continuous process based on an absolutely reliable conveyor, as well as an ingenious mechanical system. The conveyor system has been laid out in accordance with requirements specified for future placement machines, and optional for a maximum width of 508
The optionally available center support makes it possible to process large panel formats – an additional advantage for flexible manufacturing!
Available Transport Varieties:
> Single-Lane conveyor
> Dual-Lane conveyor (synchronous/asynchronous)
> Quad-Lane conveyor
> Multi-Track conveyor
Ideal Heat Transfer
Heat transfer has been significantly optimized for the VisionXP+ through the use of two, three or four peak zones.
Minimal distance between the nozzle sheets and the conveyor, as well as separately adjustable flow rates for the upper and lower heat zones, assure that the PCBs are heated up in an extremely uniform fashion. Stressing within the PCBs is thus minimized, and related soldering defects are reduced.
Stress-free below 50°
Depending upon the length of the system, the cooling tract in the VisionXS nitro is laid out in 2-, 3 or 4 stages. The fans in the individual
zones, which can be controlled separately as an option, allow for accurate control, and cooling gradients can be correspondingly influenced. This assures stress-free cooling for your PCBs to below 50° C, for lead-free soldering as well.
The Residue Management System
The effective Residue Management of the VisionXP+ combines the pyrolysis action mechanisms in the preheating and peak range with
cold condensation in the filter unit of the cooling zone.
The VisionXP+ is now available with optional 2 pyrolysis units as a new feature. The pyrolysis units are located underneath the inlet and outlet areas. The first pyrolysis unit cleans the process gas from the preheating zones and the second pyrolysis unit cleans the process gas from the peak zones. The degree of process gas purity is significantly increased as a result, and the process chamber is kept clean and dry. Maintenance costs are hardly affected at all, because for the second pyrolysis unit as well, the granulate only needs to be replaced once a year.
The elimination system used for the cooling section is directly integrated into the cooling circulation. It consists of filters where the
remaining residues in the process gas condense. The filter units are easily replaced even without opening the process chamber.
An additional benefit of the VisionXP+.
The VisionXP+ thereby achieves a considerably higher level of efficiency than all other commercially available systems, which work with different operating principles.
Easy maintenance due to quick exchange of the colling and filter units!
Low Outlet Temperature
Thanks to “bottom cooling”, the VisionXP+ is now also capable of cool-ing PCBs with large thermal masses homogeneously, and very effectively. Low outlet temperatures eliminate the need for additional cooling with the help of an external cooler or an outlet
conveyor with fans, even for PCBs with large thermal masses.
As is also the case with all of the other fans throughout the entire system, the bottom cooling fans can be individually controlled.
As a result, you can ideally adapt cooling parameters at the VisionXP+ to your PCB.
With the nitrogen control the desired ppm level is held constant by continuously measuring the residual oxygen value. This is accomplished by injecting nitrogen into the process chamber in a variable fashion depending upon the measured residual oxygen
value. This results in varying nitrogen consumption levels depending upon the extent to which the reflow system is loaded with PCBs and the selected conveyor width, allowing for reduced nitrogen consumption.
Nitrogen control is advisable for flexible SMD production lines with variable loading circumstances and conveyor widths.
In the case of air doping, the process chamber is contaminated with atmospheric oxygen. A defined leak is created in the process chamber by means of a servo-valve to this end, which is opened just far enough to generate the desired residual oxygen value. The reflow system’s nitrogen consumption is not influenced by this procedure, and always remains constant. Air doping is advisable for SMD production lines for which loading circumstances and conveyor widths vary only minimally in the reflow oven.
available with vacuum option.
The new vacuum module of the VisionXP+ provides for void-free solder joints after convection reflow soldering in a single process. Void
rates of less than 2% are made possible by vacuum of down to 2 mbar.
The PCBs are forwarded directly from the reflow process to the vacuum module, and from there to the cooling tract. When the PCBs
are forwarded directly from the peak zone to the vacuum process, the solder is still in its ideally melted state, which means that voids can
be reliably removed during the vacuum process. Due to the fact that the vacuum chamber is isolated from the conveyor, the subsequent
cooling process can be individually configured. Shortened, extended and even pulsed cooling processes are possible!