Technical data

 

BROCHURE FLYER

 

 

VisionXs nitro 2100 2450 3150 3500 3850 4200 4550 4550
type 422 type 523 type 634 type 734 type 834 type 934 type 944 type 945
DIMENSIONS AND WEIGHTS
Length 4290 mm 4990 mm 6040 mm 6390 mm 6740 mm 7090 mm 7440 mm 7790 mm
Width  1466 mm
Height (at transport height 900 mm)  1439 mm
Height with open hoods (at transport heigth 900 mm) ca./ approx 1898 mm
Free PCB loading area ca./ approx 200 mm
Required area 6,14 m2 7,15 m2 8,65 m2 9,15 m2 9,65 m2 10,15 m2 10,65 m2 11,15 m2
Weight (according to options up to 500 kg / 1100 lb more) ca. 2100 kg ca. 2500 kg ca. 3600 kg ca. 3900 kg ca. 4100 kg ca. 4400 kg ca. 4600 kg ca. 5100 kg
Load per unit area 400 kg/m2
PROCESS CHAMBER HEATING
Length 2100 mm 2450 mm 3150 mm 3500 mm 3850 mm 4200 mm 4550 mm 4550 mm
Quantity of preheating zones 4 5 6 7 8 9 9 9
Length of preheating zones 1400 mm 1750 mm 2100 mm 2450 mm 2800 mm 3150 mm 3150 mm 3150 mm
Quantity of peak zones 2 2 3 3 3 3 4 4
Length of peak zones 700 mm 700 mm 1050 mm 1050 mm 1050 mm 1050 mm 1400 mm 1400 mm
Max. permissible soldering temperature : preheating zones 300 °C
Max. permissible soldering temperature : peak zones 350 °C
Heat transfer through Forced convection
Gas circulation per heating zone max. 350 m3/h
Warm up time ca. 30 min / approx 30 min
Cross profile (Delta T = Tmax _ Tmin) ± 2,5 Kelvin
COOLING ZONE
Length 700 mm 1050 mm 1400 mm 1400 mm 1400 mm 1400 mm 1400 mm 1750 mm
MESH BELT CONVEYOR
Width 461 mm
PIN CHAIN CONVEYOR
Transport Level 900 mm ±75 mm
Width, single conveyor ±0,5 mm / without CBS Standard: 50 mm – 400 mm
Option 1: 50 mm – 460 mm
Option 2: 50 mm – 508 mm
Width, single conveyor ±0,5 mm / with CBS Standard: 65 mm – 400 mm
Option 1: 100 mm – 460 mm
Option 2: 140 mm – 508 mm
Tolerance conveyor speed (1 % per 1800 mm/min) < = 18 mm/min
CENTRE SUPPORT
Lash heigt Lash stand off: 16mm
Distance to fixed rail lowered 20 mm
Center Support active Width Standard: 50 mm – 340 mm
Option 1: 50 mm – 380 mm
Option 2: 50 mm – 390 mm
CBS Low (Parking Position) 14 mm
OPERATING DATA
Maximum noise level 75 dBA
Room temperature between 15 °C  and 32 °C
Humidity between 30%  and 75%
Oxygen of peak zones < 100 ppm
VOLTAGE SUPPLY CONSUMPTION
Energy consumptions standby-mode 6 KW 7,5 KW  9 KW 9,9 KW 10,7 KW 11,6 KW 13,5 KW 14 KW
Connected load 41 KW 48 KW 60 KW 65 KW 69 KW 74 KW 84 KW 85 KW
Operating capacity 7,5 KW 9 KW 11 KW 11,9 KW 12,7 KW 13,6 KW 15,5 KW 16 KW
COOLING WATER AT EXTERNAL COOLING
Connection M 28 x 1,5 (22 mm Cu Rohr / 0,87 in Cu Tube)
Cooling water flow between 10 – 20 l/min (according to temperature)
Operating pressure min. 2 bar – max. 5 ba
Differential pressure between forward and return run min. 0,5 bar
NITROGEN SUPPLY
Connection M 16×1 (12 mm Cu Rohr) / M 16×1 (12 mm / 0,472 in Cu-Tube)
Nitrogen supply pressure min. 7 bar – max .10 bar
Operating pressure 5 bar
Nitrogen consumption single conveyor at <200 ppm in peak
max. 200 mm at min. 1 PCB gap		 ca. 19 m3/h ca. 20 m3/h ca. 21 m3/h ca. 22 m3/h ca. 23 m3/h ca. 24 m3/h ca. 25 m3/h ca. 26 m3/h
Nitrogen consumption with N2-control in Standby Mode 200 mm transport width. ca. 16 m3/h ca. 16 m3/h ca. 16 m3/h ca. 16 m3/h ca. 16 m3/h ca. 16 m3/h ca. 16 m3/h ca. 17 m3/h
EXHAUST PROCESS
Exhaust socket: diameter 2 x100 mm Ein- bzw. Auslauf / 2 x 3,9 in In- and Outlet
Exhaust at min. 5 mbar underpressure 2 x 200 m3/h
Exhaust temperature < 50°C

VisionXS The flexible Reflow Soldering System with futures

As a co-founder of modern ReflowConvection-Soldering Systems the company Rehm has been established successfully since 1990 in the national market as well as worldwide. The know-how and experience in reflow technology of many years is now integrated in the VisionXS-series. Optimized for customer requirements the VisionXS stands for productivity and flexibility.

The Transport System

Maintenance and downtime are reduced by means of a continuous process based on an absolutely reliable conveyor, as well as an ingenious mechanical system.
The conveyor system has been laid out in accordance with requirements specified for future placement machines, and optional for a maximum width of 508 mm.
The optionally available center support makes it possible to process large panel formats – an additional advantage for flexible manufacturing! 

Ideal Heat Transfer

Heat transfer has been significantly optimized for the VisionXS through the use of two, three or four peak zones.
Minimal distance between the nozzle sheets and the conveyor, as well as separately adjustable flow rates for the upper and lower heat zones, assure that the PCBs are heated up in an extremely uniform fashion. Stressing within the PCBs is thus minimized, and related soldering defects are reduced.

Stress-free below 50°

Depending upon the length of the system, the cooling tract in the VisionXS nitro is laid out in 2-, 3 or 4 stages. The fans in the individual
zones, which can be controlled separately as an option, allow for accurate control, and cooling gradients can be correspondingly influenced. This assures stress-free cooling for your PCBs to below 50° C, for lead-free soldering as well.

The Residue Management System

Residues which accumulate during soldering are separated by a new residue management system included in VisionXS systems. The 3-stage Residue-Management System is integrated in the oven. Each stage consists of a cooling and a filter unit. For processes with an extremely high amount of residues the extended Modular Residue-ManagementSystem (MRS) can be attached. This guarantees an absolute stable process and reduces down-time. Both systems are exchangable for the existing machine.

Benefits: 

  • optimal cleaning 
  • easy to maintain and to clean 
  • easy accessibility 
  • integrated in the oven 
  • the extended MRS can be attached
  • additional process gas cleaning
  • stable process
  • exchangeable

 

Nitrogen Control

With the nitrogen control the desired ppm level is held constant by continuously measuring the residual oxygen value. This is accomplished by injecting nitrogen into the process chamber in a variable fashion depending upon the measured residual oxygen
value. This results in varying nitrogen consumption levels depending upon the extent to which the reflow system is loaded with PCBs and the selected conveyor width, allowing for reduced nitrogen consumption.
Nitrogen control is advisable for flexible SMD production lines with variable loading circumstances and conveyor widths.

Airdoping

In the case of air doping, the process chamber is contaminated with atmospheric oxygen. A defined leak is created in the process chamber by means of a servo-valve to this end, which is opened just far enough to generate the desired residual oxygen value. The reflow system’s nitrogen consumption is not influenced by this procedure, and always remains constant. Air doping is advisable for SMD production lines for which loading circumstances and conveyor widths vary only minimally in the reflow oven.

 

options:

 

  • TRANSPORT SYSTEM
    • Mesh belt
    • Single lane
    • Dual lane
    • Multi track
    • Quad lane

 

  • RESIDUE MANAGEMENT
    • Cold condensation with cooler/filter units only nitro systems
    • Pyrolysis
    • 2nd Pyrolysis
    • VACUUM
    • Vacuum module

 

  • ENERGY EFFICIENCY
    • Internal cooling / elimination of heat emission
    • Measurement power cons.
    • Measurement nitrogen consumption
    • Supervision of volume flow with active readjustment
  • COOLING TRACT
    • Bottom cooling
    • PCU Power Cooling Unit
    • integr. cooling circuit and heat exchanger for connection to ext. facility water supplies

 

  • SOFTWARE
    • Product management
    • Traceability packages
    • Process interlock
    • ProCap
    • Profile Creator
    • KIC implementation
    • RPI
    • MES-Option ROI

 

  • OTHERS
    • Stand-By-Mode
    • SSP
    • SSP+
    • Quick Exhaust
    • Transmission zone
    • Software control for fan speed regulation
    • Pin in Paste