|type 422||type 523||type 634||type 734||type 834||type 934||type 944||type 945|
|DIMENSIONS AND WEIGHTS|
|Length||4290 mm||4990 mm||6040 mm||6390 mm||6740 mm||7090 mm||7440 mm||7790 mm|
|Height (at transport height 900 mm)||1439 mm|
|Height with open hoods (at transport heigth 900 mm)||ca./ approx 1898 mm|
|Free PCB loading area||ca./ approx 200 mm|
|Required area||6,14 m2||7,15 m2||8,65 m2||9,15 m2||9,65 m2||10,15 m2||10,65 m2||11,15 m2|
|Weight (according to options up to 500 kg / 1100 lb more)||ca. 2100 kg||ca. 2500 kg||ca. 3600 kg||ca. 3900 kg||ca. 4100 kg||ca. 4400 kg||ca. 4600 kg||ca. 5100 kg|
|Load per unit area||400 kg/m2|
|PROCESS CHAMBER HEATING|
|Length||2100 mm||2450 mm||3150 mm||3500 mm||3850 mm||4200 mm||4550 mm||4550 mm|
|Quantity of preheating zones||4||5||6||7||8||9||9||9|
|Length of preheating zones||1400 mm||1750 mm||2100 mm||2450 mm||2800 mm||3150 mm||3150 mm||3150 mm|
|Quantity of peak zones||2||2||3||3||3||3||4||4|
|Length of peak zones||700 mm||700 mm||1050 mm||1050 mm||1050 mm||1050 mm||1400 mm||1400 mm|
|Max. permissible soldering temperature : preheating zones||300 °C|
|Max. permissible soldering temperature : peak zones||350 °C|
|Heat transfer through||Forced convection|
|Gas circulation per heating zone||max. 350 m3/h|
|Warm up time||ca. 30 min / approx 30 min|
|Cross profile (Delta T = Tmax _ Tmin)||± 2,5 Kelvin|
|Length||700 mm||1050 mm||1400 mm||1400 mm||1400 mm||1400 mm||1400 mm||1750 mm|
|MESH BELT CONVEYOR|
|PIN CHAIN CONVEYOR|
|Transport Level||900 mm ±75 mm|
|Width, single conveyor ±0,5 mm / without CBS||Standard: 50 mm – 400 mm|
|Option 1: 50 mm – 460 mm|
|Option 2: 50 mm – 508 mm|
|Width, single conveyor ±0,5 mm / with CBS||Standard: 65 mm – 400 mm|
|Option 1: 100 mm – 460 mm|
|Option 2: 140 mm – 508 mm|
|Tolerance conveyor speed (1 % per 1800 mm/min)||< = 18 mm/min|
|Lash heigt||Lash stand off: 16mm|
|Distance to fixed rail lowered||20 mm|
|Center Support active Width||Standard: 50 mm – 340 mm|
|Option 1: 50 mm – 380 mm|
|Option 2: 50 mm – 390 mm|
|CBS Low (Parking Position)||14 mm|
|Maximum noise level||75 dBA|
|Room temperature||between 15 °C and 32 °C|
|Humidity||between 30% and 75%|
|Oxygen of peak zones||< 100 ppm|
|VOLTAGE SUPPLY CONSUMPTION|
|Energy consumptions standby-mode||6 KW||7,5 KW||9 KW||9,9 KW||10,7 KW||11,6 KW||13,5 KW||14 KW|
|Connected load||41 KW||48 KW||60 KW||65 KW||69 KW||74 KW||84 KW||85 KW|
|Operating capacity||7,5 KW||9 KW||11 KW||11,9 KW||12,7 KW||13,6 KW||15,5 KW||16 KW|
|COOLING WATER AT EXTERNAL COOLING|
|Connection||M 28 x 1,5 (22 mm Cu Rohr / 0,87 in Cu Tube)|
|Cooling water flow||between 10 – 20 l/min (according to temperature)|
|Operating pressure||min. 2 bar – max. 5 ba|
|Differential pressure between forward and return run||min. 0,5 bar|
|Connection||M 16×1 (12 mm Cu Rohr) / M 16×1 (12 mm / 0,472 in Cu-Tube)|
|Nitrogen supply pressure||min. 7 bar – max .10 bar|
|Operating pressure||5 bar|
|Nitrogen consumption single conveyor at <200 ppm in peak
max. 200 mm at min. 1 PCB gap
|ca. 19 m3/h||ca. 20 m3/h||ca. 21 m3/h||ca. 22 m3/h||ca. 23 m3/h||ca. 24 m3/h||ca. 25 m3/h||ca. 26 m3/h|
|Nitrogen consumption with N2-control in Standby Mode 200 mm transport width.||ca. 16 m3/h||ca. 16 m3/h||ca. 16 m3/h||ca. 16 m3/h||ca. 16 m3/h||ca. 16 m3/h||ca. 16 m3/h||ca. 17 m3/h|
|Exhaust socket: diameter||2 x100 mm Ein- bzw. Auslauf / 2 x 3,9 in In- and Outlet|
|Exhaust at min. 5 mbar underpressure||2 x 200 m3/h|
|Exhaust temperature||< 50°C|
VisionXS The flexible Reflow Soldering System with futures
As a co-founder of modern ReflowConvection-Soldering Systems the company Rehm has been established successfully since 1990 in the national market as well as worldwide. The know-how and experience in reflow technology of many years is now integrated in the VisionXS-series. Optimized for customer requirements the VisionXS stands for productivity and flexibility.
The Transport System
Maintenance and downtime are reduced by means of a continuous process based on an absolutely reliable conveyor, as well as an ingenious mechanical system.
The conveyor system has been laid out in accordance with requirements specified for future placement machines, and optional for a maximum width of 508 mm.
The optionally available center support makes it possible to process large panel formats – an additional advantage for flexible manufacturing!
Ideal Heat Transfer
Heat transfer has been significantly optimized for the VisionXS through the use of two, three or four peak zones.
Minimal distance between the nozzle sheets and the conveyor, as well as separately adjustable flow rates for the upper and lower heat zones, assure that the PCBs are heated up in an extremely uniform fashion. Stressing within the PCBs is thus minimized, and related soldering defects are reduced.
Stress-free below 50°
Depending upon the length of the system, the cooling tract in the VisionXS nitro is laid out in 2-, 3 or 4 stages. The fans in the individual
zones, which can be controlled separately as an option, allow for accurate control, and cooling gradients can be correspondingly influenced. This assures stress-free cooling for your PCBs to below 50° C, for lead-free soldering as well.
The Residue Management System
Residues which accumulate during soldering are separated by a new residue management system included in VisionXS systems. The 3-stage Residue-Management System is integrated in the oven. Each stage consists of a cooling and a filter unit. For processes with an extremely high amount of residues the extended Modular Residue-ManagementSystem (MRS) can be attached. This guarantees an absolute stable process and reduces down-time. Both systems are exchangable for the existing machine.
With the nitrogen control the desired ppm level is held constant by continuously measuring the residual oxygen value. This is accomplished by injecting nitrogen into the process chamber in a variable fashion depending upon the measured residual oxygen
value. This results in varying nitrogen consumption levels depending upon the extent to which the reflow system is loaded with PCBs and the selected conveyor width, allowing for reduced nitrogen consumption.
Nitrogen control is advisable for flexible SMD production lines with variable loading circumstances and conveyor widths.
In the case of air doping, the process chamber is contaminated with atmospheric oxygen. A defined leak is created in the process chamber by means of a servo-valve to this end, which is opened just far enough to generate the desired residual oxygen value. The reflow system’s nitrogen consumption is not influenced by this procedure, and always remains constant. Air doping is advisable for SMD production lines for which loading circumstances and conveyor widths vary only minimally in the reflow oven.