TRANSPORT SYSTEM

Reliable transport through the oven: flexible conveyor system

Your PCB passes through various system segments during the soldering process: from the preheating zone to the peak zone, and finally to the cooling tract. The most important factor for continuous processing is reliable conveyance. Our systems provide users with a customized conveyor.

Whether large or small, thick or thin, long or short – our conveyor systems can be ideally adapted to your PCB. Conveyor lanes and transport speeds are flexibly adjustable. In this way, the VisionXS makes lead-free or lead-containing soldering processes possible in a single reflow system..

Getting safely from A to B: flexible conveyor systems

Your PCB passes through various system segments during the soldering process: from the preheating zone to the peak zone, and finally to the cooling tract. The most important factor for continuous processing is reliable conveyance. Our systems provide users with a flexible conveyor.

Whether large or small, thick or thin, long or short – our conveyor systems can be ideally adapted to your PCB. Conveyor lanes and transport speed are flexibly adjustable. In this way, the VisionXP+ makes lead-free or lead-containing soldering processes possible in a single reflow system.

Various conveyor options

Various conveyor options are available depending on system configuration:

• Single-lane conveyor
  
• Two-lane conveyor (synchronous, asynchronous)
• Multi-track conveyor
• Quad-lane conveyor

RESIDUE MANAGEMENT

Reliable and clean – effective Residue Management

Substances are released from the PCBs, the solder paste and the components during production with modern SMT manufacturing lines, and these can lead to contamination of the soldering system and must therefore be filtered out of the process gas. Modern ovens with nitrogen atmosphere are equipped with so-called residue management systems which recirculate process gas within the system and purify it.

Residues which accumulate during soldering are separated by the VisionXC with the help of an efficient filter unit. The 1 to 3-stage residue management system is integrated at the front of the system. Each stage consists of a cooler and a filter. Liquid and crystalline residues are reliably removed by means of this combination. This results in minimal maintenance costs and more efficient production.

Filter/cooler units VXC

• Thorough purification and a clean process chamber
• Solution integrated into the system
• Reliable process
• Easily accessible
• Minimal maintenance costs

                                      Pyrolysis Schematic

The residue management function included in the VisionXS and  VisionXP+ combines two different modes of action: pyrolysis in the heat zone and cold condensation in the cooling tract’s filter units. Liquid and crystalline residues are effectively removed by means of this combination. Residues are separated with the help of a special granulate during pyrolysis.

Before Cracking | After Cracking

Long molecular chains are broken down (cracked) into smaller elements by means of thermal fission. Temperatures ranging from 500 to 900 °C are required to this end. Afterwards, the molecular chains are small enough to be taken up by the granulate and removed from the production process. The granulate only needs to be changed once a year, making the pyrolysis unit easy to maintain – and you profit from minimal downtime. Your manufacturing processes continue to run smoothly.

Liquid residues condense above all on the cooling tract’s filter units, by which they are then removed. The system is easy to clean. The filters are exchanged in sets at the back of the system. The process chamber doesn’t even have to be opened.

In order to make your manufacturing system even more efficient, the VisionXP+ is optionally available with double pyrolysis. Your system’s cleaning efficiency is significantly increased. The first pyrolysis unit is located underneath the inlet area. It purifies the nitrogen from the preheating zones. The second pyrolysis unit is installed beneath the outlet area and filters the process gas from the peak zones. Cleaning efficiency is significantly increased for the process gas and the soldering system’s chambers are kept clean and dry with very little maintenance and minimal downtime.

 

Advantages of VisionXP+ Residue Management

Filter/cooler units VXP+

VACUUM

Without vacuum

Void-free, with vacuum

Vacuum technologies are important in the manufacturing process of electronic assemblies. In the different processing steps for improving the quality, the vacuum is in use today. Rehm provides solutions within the convection or condensation soldering to improve solder joint quality by removing voids. The new VisionXP + can be equipped for example with a vacuum module and makes void-free convection possible. In addition, any system of CondensoX seiesare equipped with an optional vacuum process. Furthermore vacuum technology are focussed in the process of drying coated electronics. Energy-efficient, low maintenance and void-free – we offer innovative solutions for reflow soldering based on diverse options for the VisionXP+ system. A new vacuum model now permits convection soldering processes with partial vacuum – within a single process.

 

COOLING TRACT

Efficient Cooling Tract for Low Outlet Temperatures. VXS and VXP+

Efficient Cooling Tract for Low Outlet Temperatures. VXC

Depending on system length, the VisionX is equipped with a 2, 3 or 4-stage cooling tract. The fans in the individual zones, which can be controlled separately as an option, allow for accurate control and cooling gradients can be correspondingly influenced. This assure stress-free cooling for your PCBs to below 50 °C, for lead-free soldering as well.

ENERGY EFFICIENCY

OTHERS