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Work Process Expert

Smart process optimization that’s easy to retrofit WORKS Process Expert Printing module. When you combine the Process Lens with the WORKS Process Expert software, you get the world’s first self-learning inline SPI system, with fully autonomous printing process control and optimization for high-end DEK printing systems. WORKS Process Expert 4.0 can be deployed in production lines with single lane line layout or a dual lane line layout including DEK printer, Process Lens PL or 3rd party SPI, SIPLACE placement machines as well as Pre- and Post-Reflow AOIs. It is possible to install WORKS Process Expert, for example, as an additional application on the SIPLACE Line Computer or on the same computer with the Process Lens Offline programming package, or on a separate computer.

DFM HealthCheck is the offline part of the ASM ProcessExpert system and its respective software ProcessEngine and covers the Stencil Analysis based on Stencil Gerber data. No ProcessLens or other machine hardware is needed. This software tool will be installed on an Offline PC and can be operated completely offline and independent of any line or station configuration. It is not even necessary that the customer uses ProcessLens or SIPLACE stations, but since the output of the analysis is based on DEK printer items and parameters, customers need to use DEK printers to apply the recommended settings. A later Upgrade to a full ProcessExpert system including ProcessLens will be possible.

The Design For Manufacturability (DFM) HealthCheck is performed offline, in the best case before the actual stencil is made to ensure good quality stencil and design, and prevent later changes. The goal is to obtain stabilization of the solder paste printing process by recommending the best process parameters as well as printer’s start-up printing parameters for a given stencil design and production environment. DFM HealthCheck is based on an extensive and unique process knowledge database.

Still, the following data needs to be provided within the Gerber file (or manually) for the correct analysis:

  • Aperture
  • Stencil fiducials
  • Board outline (can be entered manually as well)
  • Stencil steps (if available)
  • Stencil thickness
  • PCB thickness
  • Step thickness (if a step is defined)

Reading out the stencil Gerber data, and based on the exhaustive process knowledge database, ASM ProcessEngine:

  • Analyses the stencil design thoroughly
  • Recommends the best process settings
  • Recommends start-up printing parameters (print speed, print pressure, separation speed and clean rate) to decrease solder paste printing variation. These parameters are based on DEK printer software
  • It also identifies areas with potentially high levels of variability where issues may occur

 

With its virtual printing ability, the software also gives the customer the ability to key in their intended printer and process settings, by selecting other possible parameters than the ones which are recommended and visualize any potential issues this could create.

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