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SPI – ASMPT

Smart process optimization that’s easy to retrofit WORKS Process Expert Printing module. When you combine the Process Lens with the WORKS Process Expert software, you get the world’s first self-learning inline SPI system, with fully autonomous printing process control and optimization for high-end DEK printing systems.

Innovative technologies ensure maximum precision and speed

  • Combines optical 2D and 3D measurement methods for industry-leading precision and reliability
  • 3D on-the-fly PCB warpage compensation to continuously ensure a very high measurement accuracy
  • Largest height measurement range with excellent height resolution guarantees detection of all defects (no false accepts)
  • Lowest false rate in the industry
  • Maximum measurement precision drastically reduces user assists and line stops
  • Available in single-lane and dual-lane versions
  • The Process Lens reads the ink spots and measures the print quality of the printed circuit boards. The results for each individual circuit are whispered to the next SIPLACE placement machine so that components are placed on error-free circuits only.
  • First-pass yield and process control: an extensive SPC (Statistical Process Control) software supports user to analyze their printing process in details
  • Streamlined and easy factory integration via IPC-HERMES-9852 and IPC-CFX

The WORKS application Process Expert in combination with end-of-line AOI systems now also supports operators in optimizing the placement process and in finding the defect root cause across the complete SMT line for successful removal.

Measure what matters

The Process Lens high-end 5D SPI system offers an unprecedented combination of speed and precision, and thanks to the use of powerful state-of-the-art algorithms, it understands exactly what it measures and knows how to interpret the results.

  • Innovative: DLP chips with 8 or 20 million micromirrors (standard and HD version, respectively) produce absolutely distortion-free Moiré patterns.
  • Fast and reliable: Up to 70 percent shorter inspection times and up to 80 percent fewer false calls compared to traditional SPI systems.
  • High precision: With a resolution of down to 10 µm, speed and precision are no longer mutually exclusive with the Process Lens.
  • Measures what matters: The Process Lens measures paste deposits, glue, contamination, dust, and a whole lot more – all while suppressing any measurement noise generated by the PCB.

Since the Process Lens delivers constant feedback on a variety of factors and trends beginning with the first board that leaves the printer, you can take countermeasures before the first error even occurs: true and accurate process data ensures efficient and effective process optimization.

Machine Type
System
DLP chip
Camera system
Pixel size
Vertical resolution
Height accuracy with calibration target
Paste height (max.)
Paste deposit size
X/Y gantry accuracy
Inspection speed
Measurement Shadow-free
Solder paste measurements
PCBs
Dimensions – single lane
Dimensions – dual lane (standard)
Dimensions – dual lane (in single-lane mode)
Thickness
Minimum edge clearance
Maximum weight
Maximum PCB warpage compensation range
Conveyors
Loading/unloading time – single lane
Loading/unloading time – dual lane
Machine-to-Machine communication
Machine dimensions
Length × Width
Height (conveyor height: 950 mm)
Weight
Process Lens
Description
8 million micromirrors
4 MP / Field of view 30 x 30 mm
15µm x 15 µm
0.37 µm
minore di 1 µm
1,000 µm
90 µm x 130 µm
+ 12.5 µm (at +3 s)
Up to 30 cm2/s
Volume, area, height, X- and Y-offset, shape, bridging, coplanarity
PCBs
50 × 50 mm to 610 × 560 mm (L × W)
50 × 45 mm to 375 × 260 mm (L × W)
50 × 45 mm to 375 × 460 mm (L × W)
0.5 mm to 4.5 mm
3 mm
3 kg
-6.5 mm to +6.5 mm
Conveyors
minore di 2.5 s
0 s
IPC-SMEMA-9851, IPC-HERMES-9852
Machine dimensions
1,130 × 1,300 mm
1,600 mm
780 kg
Process Lens HD
20 million micromirrors
25 MP / Field of view 50 x 50 mm
10 µm x 10 µm (high-resolution mode) 20µm x 20 µm (high-speed mode)
0.37 µm
minore di 1 µm
1,000 µm
70 µm x 125 µm (high-resolution mode) 130 µm x 200 µm (high-speed mode)
+ 12.5 µm (at +3 s)
90 cm2/s (high-speed mode)
Volume, area, height, X- and Y-offset, shape, bridging, coplanarity
PCBs
50 × 50 mm to 540 × 560 mm (L × W)
50 × 45 mm to 375 × 260 mm (L × W)
50 × 45 mm to 375 × 460 mm (L × W)
0.5 mm to 4.5 mm
3 mm
3 kg
-6.5 mm to +6.5 mm
Conveyors
minore di 2.5 s
0 s
IPC-SMEMA-9851, IPC-HERMES-9852
Machine dimensions
1,130 × 1,300 mm
1,600 mm
780 kg

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